Qualcomm Reveals More on Three High-Security Flaws
- Qualcomm unveiled more details about three critical security holes that were under “limited, targeted exploitation” in October of 2023.
- The flaws identified include: CVE-2023-33063, CVE-2023-33106.
Critical Flaws in the Spotlight
Backtracking to October 2023, Qualcomm spilled the beans on three security flaws that felt the caress of “limited, targeted exploitation”. You might not see any sense in revisiting a not-so-happy past, but trust me, Qualcomm knows what they’re doing — it’s all about lessons learned and safeguards put in place. That’s why we make sure they’re held to account, to learn from and avoid next time.
A Deep Dive into the Vulnerabilities
Now let’s get technical – the flaws were quite ‘interestingly’ named: CVE-2023-33063, with a CVSS score of 7.8, and CVE-2023-33106 that scored an 8.4. What these alphanumeric soup actually signifies are memory corruption problems in DSP Services during a remote call from HLOS to DSP. If that zapped right over your head, think of it as a naughty glitch giving you an unexpected hard time.
In essence, what we have here are three very serious security flaws that Qualcomm had previously ‘kept under wraps’. They have now released more information regarding those flaws, which indicate some serious memory corruption problems during remote calls from HLOS to DSP. It may not be easy to digest these technical jargons, kind of like the time dad tried to explain the off-side rule in football – but just remember, these flaws were no minor hiccup. Think of it as having a bad case of technological indigestion, one that left Qualcomm engineers reaching for the virtual antacids!
The moral of this tech tale? Keep your software updates as frequent as your coffee refills! Don’t ‘espresso’ your regrets later for taking your security lightly.
Original Article: https://thehackernews.com/2023/12/qualcomm-releases-details-on-chip.html